Another way to solve the problem of silicon block cutting
After the silicon ingot is cut into silicon blocks, the resulting pieces may vary in size due to the cutting process. Some of these pieces are small and do not meet recycling standards, as using them would lead to high costs and waste. Moreover, a low yield of qualified cuts can significantly impact production efficiency. To address this issue, several ideas have been proposed for handling small silicon blocks.
Previously, the method involved measuring each small piece first, then arranging them to fit a suitable size before bonding them together using stick glue. These glued blocks were then attached to the glass. Typically, at least four small pieces were used per block. However, this process was time-consuming, as each set of four pieces required about 8 hours to cure. In comparison, a normal crystal rod could be bonded in the same amount of time, yielding around 10 saw pieces. Additionally, during the cutting process, issues such as uneven film or soft plastic glue could cause thick slices or even misaligned cuts, further reducing the pass rate.
Now, a new approach is being considered: instead of using stick glue, the small pieces are directly adhered to the glass while maintaining a gap of approximately 10-15mm between them. This helps ensure that the cutting process remains efficient and accurate. It’s also crucial to make sure the pieces are properly aligned and flat on the glass to avoid any negative impact on the final cut. This method aims to reduce both time and material waste, making the overall process more streamlined and cost-effective.
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