Mitsubishi Materials develops laser cutting tool manufacturing technology

Mitsubishi Materials has introduced an innovative laser-based cutting tool manufacturing technology that significantly enhances precision machining across various industries, including automotive and electronics. Traditionally, grinding tools have been used to shape cutting tools, but this method has limitations, especially when it comes to miniaturization. The grinding wheel's size restricts the possible dimensions of the cutting tool, making it challenging to produce extremely small or complex shapes. Moreover, when working with difficult-to-machine materials like CBN (cubic boron nitride) sintered bodies or diamond, conventional methods rely on matching grinding wheels, which tend to wear out quickly and deform during the process. This leads to inconsistencies in dimensional accuracy and makes it hard to maintain high-quality standards. To overcome these challenges, Mitsubishi Materials has developed a new laser-based technique. This method uses highly concentrated laser beams to achieve a focusing diameter smaller than tens of micrometers, far surpassing the capabilities of traditional machining. Unlike grinding wheels, the laser does not cause wear, eliminating the need for frequent adjustments during the process. Additionally, since no external force is applied during laser processing, there is no risk of generating strain in the workpiece, ensuring superior dimensional accuracy. This advanced technology allows for both planar and three-dimensional machining, enabling the production of cutting tools with intricate shapes and ultra-fine edges. It opens up new possibilities for creating custom-designed tools that were previously impossible with conventional methods. Looking ahead, Mitsubishi Materials plans to integrate this technology into its product line, particularly for small-diameter end mills made from CBN sintered bodies. This innovation promises to revolutionize precision machining and improve efficiency in demanding industrial applications.

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